IBM and 3M are working together to create an adhesive that can be used to stick layers of semiconductors together. Using some 100 such layers, they should be able to create some fast commercial-grade processors. IBM believes that taking this approach should give the ability to create processors that are roughly 1000 times faster than the ones used today. 3M will be working on an adhesive that can stick these layers together but also act as an effective cooling medium that can transfer heat quickly.

Some people love fast cars, I am not brave enough to get past 134 mph even on a safe track, so instead I love fast processors. So the news that IBM sticks chips with 3M tape to make them 1000x faster. No, this isn’t an ‘April Fool’s Day’ prank, it’s the future, according to IBM and 3M. IBM has found a partner in an unlikely brand, 3M that’s known best for making adhesive tapes. This has nothing to do with new supper conducting material or some supper cool environment that needs a fridge the size of a house.

I love IBM investment in Research and Development - For decades they have consistently filed more patents than any other single organization in the world. Recently they were building world’s largest drive with capacity of 120 million GB. This surely must be ordered by Google or Amazon as they constantly need bigger storage. They have also recently been working on some of the fastest data transfer systems Capable of 5GB/s Transfer Rate. These capabilities combined with this kind of processing power is bound to produce a pc that is truly capable of running 1000 times faster than a typical pc and hard drive and data transfer to match this kind of processing power.

IBM’s VP of Research said that it was important to develop these technologies so that products such as tablets and smartphones could take advantage of a vast amount of computing power while keeping power requirements low. IBM and 3M want to take this sticky bonding further by trying to stick thousands of wafers to yield even more power than is possible today.

With IBM supplying its microprocessor and silicon expertise and 3M contributing its super-cool adhesive, the two companies aim to stack together processors, memory chips and networks into monster “skyscrapers” of silicon they say will be 1,000 times faster than today’s fastest processor.

When can we get our hands on this breakthrough tech? IBM’s media relations representative Michael Corrado tells us, “By the end of 2013 it should go into production. It’ll show up on servers first, and then a year after those consumers might see it.”

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These are various Salar Golestanian Blog some long and some short about the latest topics that interest me about Technology, Design, Mobile or Desktop Internet and all that is within its jurisdiction. Probably the best place for these would have been in SalarO.com, However, some Blogs have less of a commercial or corporate genra, so here they are placed in my personal site. These Blogs help me explain a little more then normally allowed in the 140 character real estate of Twitter posts. They may also link you to the actual news or site that expands further on my comments.